enow.com Web Search

Search results

  1. Results from the WOW.Com Content Network
  2. Physical vapor deposition - Wikipedia

    en.wikipedia.org/wiki/Physical_vapor_deposition

    Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a ...

  3. Cathodic arc deposition - Wikipedia

    en.wikipedia.org/wiki/Cathodic_arc_deposition

    Cathodic arc deposition or Arc-PVD is a physical vapor deposition technique in which an electric arc is used to vaporize material from a cathode target. The vaporized material then condenses on a substrate, forming a thin film. The technique can be used to deposit metallic, ceramic, and composite films.

  4. Sputter deposition - Wikipedia

    en.wikipedia.org/wiki/Sputter_deposition

    Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. [1] [2]

  5. Category:Physical vapor deposition techniques - Wikipedia

    en.wikipedia.org/wiki/Category:Physical_vapor...

    Pages in category "Physical vapor deposition techniques" The following 10 pages are in this category, out of 10 total. This list may not reflect recent changes. C.

  6. Vacuum deposition - Wikipedia

    en.wikipedia.org/wiki/Vacuum_deposition

    When the vapor source is a liquid or solid, the process is called physical vapor deposition (PVD), [3] which is used in semiconductor devices, thin-film solar panels, and glass coatings. [4] When the source is a chemical vapor precursor, the process is called chemical vapor deposition (CVD).

  7. High-power impulse magnetron sputtering - Wikipedia

    en.wikipedia.org/wiki/High-power_impulse...

    The deposition of copper films by HIPIMS was reported for the first time by V. Kouznetsov for the application of filling 1 μm vias with aspect ratio of 1:1.2 [10] Transition metal nitride (CrN) thin films were deposited by HIPIMS for the first time in February 2001 by A.P. Ehiasarian. [ 11 ]

  8. Electron-beam physical vapor deposition - Wikipedia

    en.wikipedia.org/wiki/Electron-beam_physical...

    The PVD process can be carried out at lower deposition temperatures and without corrosive products, but deposition rates are typically lower. Electron-beam physical vapor deposition, however, yields a high deposition rate from 0.1 to 100 μm/min at relatively low substrate temperatures, with very high material utilization efficiency. The ...

  9. Sublimation sandwich method - Wikipedia

    en.wikipedia.org/wiki/Sublimation_sandwich_method

    The sublimation sandwich method (also called the sublimation sandwich process and the sublimation sandwich technique) is a kind of physical vapor deposition used for creating man-made crystals. Silicon carbide is the most common crystal grown this way, though other crystals may also be created with it (notably gallium nitride).