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  2. Wire bonding - Wikipedia

    en.wikipedia.org/wiki/Wire_bonding

    Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...

  3. Ball bonding - Wikipedia

    en.wikipedia.org/wiki/Ball_bonding

    Gold wire ball-bonded on a transistor die. Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a bare silicon die and the lead frame of the package it is placed in during semiconductor device fabrication.

  4. Chip on board - Wikipedia

    en.wikipedia.org/wiki/Chip_on_board

    In "wire bonding", the chip is attached to the board with an adhesive. Each pad on the device is connected with a fine wire lead that is welded to the pad and to the circuit board. This is similar to the way that an integrated circuit is connected to its lead frame, but instead the chip is wire-bonded directly to the circuit board. [3]

  5. Thermosonic bonding - Wikipedia

    en.wikipedia.org/wiki/Thermosonic_bonding

    Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father of Thermosonic Bonding" by George Harman, [ 1 ] the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics .

  6. Electrical bonding - Wikipedia

    en.wikipedia.org/wiki/Electrical_bonding

    Electrical bonding is the practice of intentionally electrically connecting all exposed metal items not designed to carry electricity in a room or building as protection from electric shock. Bonding is also used to minimize electrical arcing between metal surfaces with electrical potential differences.

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  8. Lead frame - Wikipedia

    en.wikipedia.org/wiki/Lead_frame

    The die is glued or soldered to the die pad inside the lead frame, and then bond wires are attached between the die and the bond pads to connect the die to the leads in a process called wire bonding. In a process called encapsulation, a plastic case is moulded around the lead frame and die, exposing only the leads.

  9. Top 10 moments on 'The View' in 2024: Kamala Harris bungles ...

    www.aol.com/top-10-moments-view-2024-100016348.html

    Kamala Harris' Bungled Answer On ‘The View’ About Biden Seen As Turning Point For Campaign. During a live interview on the show in October, co-host Sunny Hostin asked the vice president if ...

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