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All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset. Includes integrated RDNA2 GPU with 2 CUs and base, boost clock speeds of 0.4 GHz, 2.2 GHz. L1 cache: 80 KB (48 KB data + 32 KB instruction) per core. L2 cache: 1 MB per core. Fabrication process: TSMC N4 FinFET (N6 FinFET for the I/O die).
Two AMD Ryzen 9000 series microprocessors with Zen 5 architecture. Zen 5 is the name for a CPU microarchitecture by AMD, shown on their roadmap in May 2022, [3] launched for mobile in July 2024 and for desktop in August 2024. [4]
The Ryzen family is an x86-64 microprocessor family from AMD, based on the Zen microarchitecture.The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper with up to 96 cores.
[4] AMD Zen 3+ Family 19h – 2022 revision of Zen 3 used in Ryzen 6000 mobile processors using a 6 nm process. AMD Zen 4 Family 19h – fourth generation Zen architecture, in 5 nm process. [5] Used in Ryzen 7000 consumer processors on the new AM5 platform with DDR5 and PCIe 5.0 support. Adds support for AVX-512 instruction set.
Ryzen 3 PRO 2100GE [2] found in some OEM markets in limited quantities. Ryzen (/ ˈ r aɪ z ən / RY-zən) [3] is a brand [4] of multi-core x86-64 microprocessors, designed and marketed by AMD for desktop, mobile, server, and embedded platforms, based on the Zen microarchitecture.
One physical PCIe 2.0×16 slot or two physical PCIe 2.0×16 slots @ ×8, one PCIe 2.0×4 slot and two PCIe 2.0×1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 2.0 for A-Link Express III solely in the Northbridge; HyperTransport 3.0 up to 5200 MT/s and PCI Express 2.0; Support for up to two graphics cards; 14 Watt TDP
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The 16 core Zen 4c CCD is 9.6% larger in area than the regular 8 core Zen 4 CCD. [49] The Zen 4c CCD die size measures at 72.7 mm 2 compared to the 66.3 mm 2 die area for the Zen 4 CCD. However, an individual Zen 4c core has a smaller footprint than a Zen 4 core, meaning that a larger number of smaller cores can be fitted into the CCD.