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Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. [ 1 ]
Electroplating of acid gold on underlying copper- or nickel-plated circuits reduces contact resistance as well as surface hardness. Copper-plated areas of mild steel act as a mask if case-hardening of such areas are not desired. Tin-plated steel is chromium-plated to prevent dulling of the surface due to oxidation of tin.
Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde .
Copper plating may refer to: Copper electroplating , a technique of electroplating a layer of copper onto a metal object Electroless copper plating , an auto-catalytic chemical technique used to deposit a layer of copper on a solid workpiece
Copper foil is a thin sheet of copper metal that is widely used in various applications due to its excellent electrical conductivity, malleability, and corrosion resistance. It is an essential material in the electronics industry, especially for manufacturing printed circuit boards (PCBs) and other electronic components.
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Electroplating – a process where a thin layer of metal is deposited onto the surface of an object using an electric current; Electrochemical cells – generates electrical energy from chemical reactions; Electrotyping – a process used to create metal copies of designs by depositing metal onto a mold using electroplating
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