Search results
Results from the WOW.Com Content Network
A thermal profile is a complex set of time-temperature data typically associated with the measurement of thermal temperatures in an oven (ex: reflow oven). The thermal profile is often measured along a variety of dimensions such as slope, soak, time above liquidus (TAL), and peak. A thermal profile can be ranked on how it fits in a process ...
Process window index (PWI) is a statistical measure that quantifies the robustness of a manufacturing process, e.g. one which involves heating and cooling, known as a thermal process. In manufacturing industry, PWI values are used to calibrate the heating and cooling of soldering jobs (known as a thermal profile) while baked in a reflow oven .
Thermal Integrity Profiling (TIP) is a non-destructive testing method used to evaluate the integrity of concrete foundations. It is standardized by ASTM D7949 - Standard Test Methods for Thermal Integrity Profiling of Concrete Deep Foundations. The testing method was first developed in the mid 1990s at the University of South Florida.
Example Ramp to Spike thermal profile. Example of reflow soldering thermal profile.. Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat.
The moment method was developed from the observation that the plot of the second derivative of the thermal profile for laminar flow over a plate looks very much like a Gaussian distribution curve. [9] It is straightforward to cast the properly scaled thermal profile into a suitable integral kernel. The thermal profile central moments are ...
The Relative thermal index (RTI) is a characteristic parameter related to the ability of plastic materials to resist thermal degradation. The RTI is part of the longterm thermal aging program (LTTA) described in the UL 746B standard from UL .
Thermal profiling is the act of measuring several points on a circuit board to determine the thermal excursion it takes through the soldering process. In the electronics manufacturing industry, SPC (Statistical Process Control) helps determine if the process is in control, measured against the reflow parameters defined by the soldering ...
What links here; Related changes; Upload file; Special pages; Permanent link; Page information; Cite this page; Get shortened URL; Download QR code