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A thermal profile is a complex set of time-temperature data typically associated with the measurement of thermal temperatures in an oven (ex: reflow oven). The thermal profile is often measured along a variety of dimensions such as slope, soak, time above liquidus (TAL), and peak. A thermal profile can be ranked on how it fits in a process ...
For each profile statistic the percentage used of the respective process window is calculated, and the worst case (i.e. highest percentage) is the PWI. For example, a thermal profile with three thermocouples, with four profile statistics logged for each thermocouple, would have a set of twelve statistics for that thermal profile. In this case ...
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP ...
Example Ramp to Spike thermal profile. Example of reflow soldering thermal profile.. Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat.
Thermal simulations give engineers a visual representation of the temperature and airflow inside the equipment. Thermal simulations enable engineers to design the cooling system; to optimise a design to reduce power consumption, weight and cost; and to verify the thermal design to ensure there are no issues when the equipment is built.
The moment method was developed from the observation that the plot of the second derivative of the thermal profile for laminar flow over a plate looks very much like a Gaussian distribution curve. [9] It is straightforward to cast the properly scaled thermal profile into a suitable integral kernel. The thermal profile central moments are ...
A direct practical application of the heat equation, in conjunction with Fourier theory, in spherical coordinates, is the prediction of thermal transfer profiles and the measurement of the thermal diffusivity in polymers (Unsworth and Duarte). This dual theoretical-experimental method is applicable to rubber, various other polymeric materials ...
Thermal Integrity Profiling (TIP) is a non-destructive testing method used to evaluate the integrity of concrete foundations. It is standardized by ASTM D7949 - Standard Test Methods for Thermal Integrity Profiling of Concrete Deep Foundations. The testing method was first developed in the mid 1990s at the University of South Florida.