enow.com Web Search

Search results

  1. Results from the WOW.Com Content Network
  2. Thermal copper pillar bump - Wikipedia

    en.wikipedia.org/wiki/Thermal_copper_pillar_bump

    A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).

  3. Corona treatment - Wikipedia

    en.wikipedia.org/wiki/Corona_treatment

    Many substrates provide a better bonding surface when they are treated at the time they are produced. This is called “pre-treatment.” The effects of corona treatment diminish over time. Therefore, many surfaces will require a second “bumptreatment at the time they are converted to ensure bonding with printing inks, coatings, and ...

  4. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  5. Hands-free computing - Wikipedia

    en.wikipedia.org/wiki/Hands-free_computing

    Hands-free computing is important because it is useful to both able and disabled users. Speech recognition systems can be trained to recognize specific commands and upon confirmation of correctness instructions can be given to systems without the use of hands. This may be useful while driving or to an inspector or engineer in a factory environment.

  6. Flip chip - Wikipedia

    en.wikipedia.org/wiki/Flip_chip

    Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.

  7. Thermal relief - Wikipedia

    en.wikipedia.org/wiki/Thermal_relief

    Thermal pads can be seen in several locations on this printed circuit board (PCB), in particular, the bottom pad of the three vertical pads in the top left corner. A thermal relief pad, thermal pad or simply thermal, is a printed circuit board (PCB) pad connected to a copper pour using a thermal connection. It looks like a normal pad with ...

  8. Heat therapy - Wikipedia

    en.wikipedia.org/wiki/Heat_therapy

    Heat therapy, also called thermotherapy, is the use of heat in therapy, such as for pain relief and health. It can take the form of a hot cloth, hot water bottle, ultrasound, heating pad, hydrocollator packs, whirlpool baths, cordless FIR heat therapy wraps, and others.

  9. Electron-beam technology - Wikipedia

    en.wikipedia.org/wiki/Electron-beam_technology

    Electron-beam evaporation uses thermionics emission to create a stream of electrons that are accelerated by a high-voltage cathode and anode arrangement. Electrostatic and magnetic fields focus and direct the electrons to strike a target. The kinetic energy is transformed into thermal energy at or near the surface of the material.