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The decision to move to a chiplet-based GPU microarchitecture was led by AMD Senior Vice President Sam Naffziger who had also lead the chiplet initiative with Ryzen and Epyc. [6] The development of RDNA 3's chiplet architecture began towards the end of 2017 with Naffziger leading the AMD graphics team in the effort. [7]
AMD is showing off its latest AI PC and graphics chips at CES 2025 in Las Vegas.The company on Monday announced its new Ryzen AI Max, additional Ryzen AI 300, and Ryzen AI 200 central processing ...
Graphics Core Next (GCN) [1] is the codename for a series of microarchitectures and an instruction set architecture that were developed by AMD for its GPUs as the successor to its TeraScale microarchitecture. The first product featuring GCN was launched on January 9, 2012.
AMD support Year introduced Introduced with Rendering Computing / ROCm; Vulkan [17] OpenGL [18] Direct3D HSA OpenCL; Wonder: Fixed-pipeline [a] 1000 nm 800 nm — — — — — Ended 1986 Graphics Solutions Mach: 800 nm 600 nm 1991 Mach8 3D Rage: 500 nm 5.0 1996 3D Rage Rage Pro: 350 nm 1.1 6.0 1997 Rage Pro Rage 128: 250 nm 1.2 1998 Rage 128 ...
AMD EPS Estimates for Current Fiscal Year data by YCharts.. The market could reward this sharp increase in AMD's earnings with solid gains next year. That's why it would be a good idea to buy this ...
Lastly, keep in mind that AMD is also developing a successor GPU to the MI300 called the MI325X -- slated to launch in 2025. Moreover, the company's MI400 architecture is targeting a launch date ...
CDNA (Compute DNA) is a compute-centered graphics processing unit (GPU) microarchitecture designed by AMD for datacenters. Mostly used in the AMD Instinct line of data center graphics cards, CDNA is a successor to the Graphics Core Next (GCN) microarchitecture; the other successor being RDNA (Radeon DNA), a consumer graphics focused microarchitecture.
Zen 5 was designed with both 4nm and 3nm processes in mind. This acted as an insurance policy for AMD in the event that TSMC's mass production of its N3 nodes were to face delays, significant wafer defect issues or capacity issues.