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Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]
Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.
About 100 times slower erosion of copper than ordinary tin/lead alloys. Suitable for soldering thin copper platings and very thin copper wires. [56] Sn 60 Pb 39 Cu 1: Pb: No: Sn 60 Pb 38 Cu 2: 183: 190 [16] [17] Pb: Cu2. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten ...
Used with flux. Unsuitable for vacuum brazing due to high zinc content. Worse corrosion resistance due to higher alloying. Tendency to liquation, has to be heated rapidly through the melting range. Grayish-white color. 4: 10: 76: 10: Zn 98 Al 2: 382/392 [4] – AL 802. General purpose filler metal for aluminium soldering/brazing with a torch ...
Wave soldering uses surface tension to keep solder from bridging the insulating gaps between the copper lines of flux-coated printed wiring boards/printed circuit boards. The electric soldering iron is widely used for hand-soldering, consisting of a heating element in contact with the "iron" (a larger mass of metal, usually copper) which is in ...
Deoxidizer, decomposes copper oxide; phosphorus-bearing alloys can be used on copper without flux. Does not decompose zinc oxide, so flux is needed for brass. Forms brittle phosphides with some metals, e.g. nickel (Ni 3 P) and iron, phosphorus alloys unsuitable for brazing alloys bearing iron, nickel or cobalt in amount above 3%.
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