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  2. Power MOSFET - Wikipedia

    en.wikipedia.org/wiki/Power_MOSFET

    NXP 7030AL - N-channel TrenchMOS logic level FET IRF640 Power Mosfet die. The power MOSFET is the most widely used power semiconductor device in the world. [3] As of 2010, the power MOSFET accounts for 53% of the power transistor market, ahead of the insulated-gate bipolar transistor (27%), RF power amplifier (11%) and bipolar junction transistor (9%). [24]

  3. MOSFET - Wikipedia

    en.wikipedia.org/wiki/MOSFET

    With the vertical structure, the component area is roughly proportional to the current it can sustain, and the component thickness (actually the N-epitaxial layer thickness) is proportional to the breakdown voltage. [75] Power MOSFETs with lateral structure are mainly used in high-end audio amplifiers and high-power PA systems.

  4. Power semiconductor device - Wikipedia

    en.wikipedia.org/wiki/Power_semiconductor_device

    A power semiconductor device is usually used in "commutation mode" (i.e., it is either on or off), and therefore has a design optimized for such usage; it should usually not be used in linear operation. Linear power circuits are widespread as voltage regulators, audio amplifiers, and radio frequency amplifiers.

  5. Field-effect transistor - Wikipedia

    en.wikipedia.org/wiki/Field-effect_transistor

    The IGBT (insulated-gate bipolar transistor) is a device for power control. It has a structure akin to a MOSFET coupled with a bipolar-like main conduction channel. These are commonly used for the 200–3000 V drain-to-source voltage range of operation. Power MOSFETs are still the device of choice for drain-to-source voltages of 1 to 200 V.

  6. Safe operating area - Wikipedia

    en.wikipedia.org/wiki/Safe_operating_area

    The safe operating area curve is a graphical representation of the power handling capability of the device under various conditions. The SOA curve takes into account the wire bond current carrying capability, transistor junction temperature, internal power dissipation and secondary breakdown limitations.

  7. CMOS - Wikipedia

    en.wikipedia.org/wiki/CMOS

    CMOS inverter (a NOT logic gate) Complementary metal–oxide–semiconductor (CMOS, pronounced "sea-moss", / siːmɑːs /, /- ɒs /) is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. [ 1 ]

  8. LDMOS - Wikipedia

    en.wikipedia.org/wiki/LDMOS

    LDMOS. LDMOS (laterally-diffused metal-oxide semiconductor) [1] is a planar double-diffused MOSFET (metal–oxide–semiconductor field-effect transistor) used in amplifiers, including microwave power amplifiers, RF power amplifiers and audio power amplifiers. These transistors are often fabricated on p/p + silicon epitaxial layers.

  9. Time-dependent gate oxide breakdown - Wikipedia

    en.wikipedia.org/wiki/Time-dependent_gate_oxide...

    There are different breakdown models and thickness of the gate oxide determines the validity of the model. E model, 1/E model and power law exponential model are common models which depict the breakdown behavior. The failure types for integrated circuit (IC) components follow the classic bath tub curve. There is infant mortality, which is ...

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