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A vacuum chamber is a rigid enclosure from which air and other gases are removed by a vacuum pump. This results in a low- pressure environment within the chamber, commonly referred to as a vacuum . A vacuum environment allows researchers to conduct physical experiments or to test mechanical devices which must operate in outer space (for example ...
Vacuum systems usually consist of gauges, vapor jet and pumps, vapor traps and valves along with other extensional piping. A vessel that is operating under vacuum system may be any of these types such as processing tank, steam simulator, particle accelerator, or any other type of space that has an enclosed chamber to maintain the system in less than atmospheric gas pressure.
The most common sources of trouble (out-gassing) in vacuum systems are: Cadmium, often present in the form of cadmium plating, or in some soldering and brazing alloys; Zinc, problematic for high vacuum and higher temperatures, present in some construction alloys, e.g. brass and some brazing alloys.
In tubes used in electronics, the getter material coats plates within the tube which are heated in normal operation; when getters are used within more general vacuum systems, such as in semiconductor manufacturing, they are introduced as separate pieces of equipment in the vacuum chamber, and turned on when needed. Deposited and patterned ...
The system is an axial compressor that puts energy into the gas, rather than a turbine, which takes energy out of a moving fluid to create rotary power, thus "turbomolecular pump" is a misnomer. Gas captured by the upper stages is pushed into the lower stages and successively compressed to the level of the fore-vacuum (backing pump) pressure.
A vacuum table is a system for holding workpieces during machining. The device consists of a perforated table top containing a vacuum chamber , and a vacuum pump to keep the vacuum chamber below ambient enough pressure.
A typical (parallel plate) RIE system consists of a cylindrical vacuum chamber, with a wafer platter situated in the bottom portion of the chamber. The wafer platter is electrically isolated from the rest of the chamber. Gas enters through small inlets in the top of the chamber, and exits to the vacuum pump system through the
Ultra-high vacuum (often spelled ultrahigh in American English, UHV) is the vacuum regime characterised by pressures lower than about 1 × 10 −6 pascals (1.0 × 10 −8 mbar; 7.5 × 10 −9 Torr). UHV conditions are created by pumping the gas out of a UHV chamber.