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MoCA 1.0 MoCA 1.1 MoCA 2.0 MoCA 2.0 bonded MoCA 2.1 MoCA 2.1 bonded MoCA 2.5 MoCA 3.0 Actual throughput (Mbit/s) 100 175 500 1000 500 1000 2500 10,000 Number of channels bonded 2 2 3~5 ≤4 Power save (standby and sleep) Yes Yes Yes Yes Yes Yes MoCA protected setup; MPS Yes Yes Yes Management proxy Yes Yes Yes Enhanced privacy Yes Yes
In March 1986, Hitron founded on agency of electronic equipment. It begin with 9 employees and NT$8,000,000 in capital. In 1987, Hitron entered IT and communication industries. In 1989, Hitron entered in the field of GIS. In 1996, Hitron constructed HtNet to provide dial-up internet access service as an Internet service provider. The URL is www ...
The first Ethernet standard, known as 10BASE5 (ThickNet) in the family of IEEE 802.3, specified baseband operation over 50 ohm coaxial cable, which remained the principal medium into the 1980s, when 10BASE2 (ThinNet) coax replaced it in deployments in the 1980s; both being replaced in the 1990s when thinner, cheaper twisted pair cabling came to dominate the market.
The basic process stages of the mechanical molding and casting process are similar to those described under the manual sand casting process. The technical and mental development however was so rapid and profound that the character of the sand casting process changed radically.
Intel Mobile Celeron in a flip-chip BGA package (FCBGA-479); the BGA package substrate or flip chip substrate, also called a BGA or flip chip interposer, is dark yellow, and the silicon die appears dark blue Underside of a die from a flip chip package, the top metal layer on the IC die or top metallization layer, and metallized pads for flip chip mounting are visible
A tendon is grouted to the concrete or rock at its far (internal) end and has a significant de-bonded free length at its external end which allows the tendon to stretch during tensioning. Tendons may be full-length-bonded to the surrounding concrete or rock once tensioned, or (more commonly) have strands permanently encapsulated in corrosion ...
Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be ...
Bonding is also used to minimize electrical arcing between metal surfaces with electrical potential differences. If a failure of electrical insulation occurs, all bonded metal objects in the room will have substantially the same electrical potential, so that an occupant of the room cannot touch two objects with significantly different potentials.