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  2. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    Printed circuit board of a DVD player. Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the conductive traces, the through-hole paths to the other surface, and some electronic components mounted using through-hole mounting. A printed circuit board (PCB), also called printed wiring board (PWB), is a medium ...

  3. Printed circuit board milling - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board_milling

    Printed circuit board milling (also: isolation milling) is the milling process used for removing areas of copper from a sheet of printed circuit board (PCB) material to recreate the pads, signal traces and structures according to patterns from a digital circuit board plan known as a layout file. [1] Similar to the more common and well known ...

  4. Via (electronics) - Wikipedia

    en.wikipedia.org/wiki/Via_(electronics)

    A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating ...

  5. Photochemical machining - Wikipedia

    en.wikipedia.org/wiki/Photochemical_machining

    Photochemical machining. Photochemical machining (PCM), also known as photochemical milling or photo etching, is a chemical milling process used to fabricate sheet metal components using a photoresist and etchants to corrosively machine away selected areas. This process emerged in the 1960s as an offshoot of the printed circuit board industry.

  6. Flat no-leads package - Wikipedia

    en.wikipedia.org/wiki/Flat_no-leads_package

    Flat no-leads package. 28-pin QFN, upside down to show contacts and thermal/ground pad. Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a ...

  7. Etching (microfabrication) - Wikipedia

    en.wikipedia.org/wiki/Etching_(microfabrication)

    Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which ...

  8. Occam process - Wikipedia

    en.wikipedia.org/wiki/Occam_process

    The Occam process is a solder -free, Restriction of Hazardous Substances Directive (RoHS)-compliant method for use in the manufacturing of electronic circuit boards developed by Verdant Electronics. It combines the usual two steps of constructing printed circuit boards (PCBs) followed by the population process of placing various leaded and non ...

  9. Plasma etching - Wikipedia

    en.wikipedia.org/wiki/Plasma_etching

    A plasma etcher, or etching tool, is a tool used in the production of semiconductor devices. A plasma etcher produces a plasma from a process gas, typically oxygen or a fluorine -bearing gas, using a high frequency electric field, typically 13.56 MHz. A silicon wafer is placed in the plasma etcher, and the air is evacuated from the process ...