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Wafers grown using materials other than silicon will have different thicknesses than a silicon wafer of the same diameter. Wafer thickness is determined by the mechanical strength of the material used; the wafer must be thick enough to support its own weight without cracking during handling.
What is the thickness variation within a silicon wafer? Standard thickness variation across a wafer is typically +/- 5 microns. More stringent requirements can achieve +/- 1-2 micron uniformity through precision machining and polishing methods.
Choosing the right silicon wafer thickness is crucial for the success of a research project. The selection process involves a combination of theoretical understanding, practical considerations, and sometimes trial and error. Here's a guideline on how a researcher can determine the appropriate silicon wafer thickness for their project:
The wafer thickness was determined to be 275 μm for 2-in. wafers, 375 μm for 3-in. wafers, 525 μm for 100-mm wafers and 625 and 675 μm for 125- and 150-mm wafers, respectively. The current high volume wafers, 200- and 300-mm diameter, are produced with thicknesses of 725 and 775 μm, respectively.
Silicon, Si - the most common semiconductor, single crystal Si can be processed into wafers up to 450 mm in diameter. Wafers are thin (thickness depends on wafer diameter, but is typically less than 1 mm), circular slice of single-crystal semiconductor material cut from the ingot of single crystal semiconductor.
Beyond this, silicon wafers also must meet certain defect kinetic properties in device processing, which depend on the wafer thickness as well and are crucial for device yield and economic feasibility.
Silicon wafers are thin slices of highly pure crystalline Silicon, used in the production of integrated circuits. This article delves into the fascinating world of silicon wafers, unraveling their production process, unique properties, and the wide range of applications that make them indispensable.
Below are the most common mechanical specifications for silicon wafers: 1) Crystal Growth and Doping Process. - specifies the wafer's single crystal growing process, i.e., whether CZ or FZ. - specifies the wafer's doping process, e.g., ion implantation, etc. 2) Wafer Diameter.
Thickness of the silicon wafer (substrate) is typically 725 mm in 200 mmϕ wafer and 775 mm in 300 mm ϕ wafer, respectively. Uniformity of the silicon core width and thickness is a key parameter for the reliable operation of Si photonics devices.
Explore the mechanical specifications for silicon wafers. Learn about thickness, flatness, diameter, and other important parameters at Wafer World.