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Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface.
The Computer History Museum claims to house the largest and most significant collection of computing artifacts in the world. [a] This includes many rare or one-of-a-kind objects such as a Cray-1 supercomputer as well as a Cray-2, Cray-3, the Utah teapot, the 1969 Neiman Marcus Kitchen Computer, an Apple I, and an example of the first generation of Google's racks of custom-designed web servers. [7]
Deep reactive-ion etching (DRIE) is a special subclass of reactive-ion etching (RIE). It enables highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers /substrates, typically with high aspect ratios. It was developed for microelectromechanical systems (MEMS), which require these features, but ...
The region is the biggest high-tech manufacturing center in the United States. [74][75] The unemployment rate of the region was 9.4% in January 2009 and has decreased to a record low of 2.7% as of August 2019. [76] Silicon Valley received 41% of all U.S. venture investment in 2011, and 46% in 2012. [77]
This process is now largely outdated but was used up until the late 1980s when it was superseded by dry plasma etching. [1]: 147 The wafer can be immersed in a bath of etchant, which must be agitated to achieve good process control. For instance, buffered hydrofluoric acid (BHF) is used commonly to etch silicon dioxide over a silicon substrate.
This is an accepted version of this page This is the latest accepted revision, reviewed on 11 September 2024. American semiconductor equipment company Lam Research Corporation Company type Public Traded as Nasdaq: LRCX Nasdaq-100 component S&P 500 component Industry Semiconductors Founded 1980 ; 44 years ago (1980) Founder David K. Lam Headquarters Fremont, California, U.S. Key people Tim ...
A plasma etcher, or etching tool, is a tool used in the production of semiconductor devices. A plasma etcher produces a plasma from a process gas, typically oxygen or a fluorine -bearing gas, using a high frequency electric field, typically 13.56 MHz. A silicon wafer is placed in the plasma etcher, and the air is evacuated from the process ...
Dry etching can combine chemical etching with physical etching or ion bombardment. Surface micro-machining involves as many layers as are needed with a different mask (producing a different pattern) on each layer. Modern integrated circuit fabrication uses this technique and can use as many as 100 layers. Micro-machining is a younger technology ...