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The packaging employed for these semiconductor devices serves to provide protection and enables their connection to printed circuit boards. Initially, the packaging technology utilized for diodes and transistors involved canned sealing. However, with advancements in passivation technology, plastic packaging methods were introduced.
A lead frame has two sections: a die paddle, where the die sits in the leadframe, and the leads. The leadframe is made of an alloy the molding compound can adhere to, a thermal expansion coefficient that is as close as possible to that of the die and compound, has good thermal and electrical conductivity, is strong enough and has high formability.
A spreadsheet of semiconductor outline dimensions and names, cross-referencing JEDEC, ProElectron, Soviet and commercial packages, past and present. Updated semi-annually. An archived web page with links to package drawing collections of SMD, hermetic, plastic, RF, coaxial and hybrid power module varieties.corresponding to dimensions and names ...
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon ) before being diced into die, tested, and packaged.
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package ", supports the electrical contacts which connect the device to a circuit board.
The mold may be part of the finished article and may provide shielding or heat dissipating functions in addition to acting as a mold. When the mold is removed the potted assembly is described as cast. [4] As an alternative, many circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting. [5]
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...
This is known as a chip-first flow. Panel level packaging uses a large panel instead of a wafer to carry out the packaging process. [6] High end fan-out packages are those with lines and spaces narrower than 8 microns. [4] Fan-out packages can also have several dies, [5] and passive components. [6]
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