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2. Etching (microfabrication) - Wikipedia

   en.wikipedia.org/wiki/Etching_(microfabrication)

   The term "crystallographic etching" is synonymous with "anisotropic etching along crystal planes". However, for some non-crystal materials like glass, there are unconventional ways to etch in an anisotropic manner. [2] The authors employ multistream laminar flow that contains etching non-etching solutions to fabricate a glass groove.

3. Chemical milling - Wikipedia

   en.wikipedia.org/wiki/Chemical_milling

   Chemical milling or industrial etching is the subtractive manufacturing process of using baths of temperature-regulated etching chemicals to remove material to create an object with the desired shape. [1] [2] Other names for chemical etching include photo etching, chemical etching, photo chemical etching and photochemical machining. It is ...

4. Etching - Wikipedia

   en.wikipedia.org/wiki/Etching

   ferric chloride may be used for etching copper or zinc plates, whereas nitric acid may be used for etching zinc or steel plates. Typical solutions are 1 part FeCl 3 to 1 part water and 1 part nitric to 3 parts water. The strength of the acid determines the speed of the etching process. The etching process is known as biting (see also spit ...

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6. Metal assisted chemical etching - Wikipedia

   en.wikipedia.org/.../Metal_assisted_chemical_etching

   The first attempts of MACE consisted of a silicon wafer that was partially covered with aluminum and then immersed in an etching solution. [2] This material combination led to an increased etching rate compared to bare silicon. Often this very first attempt is also called galvanic etching instead of metal assisted chemical etching. [citation ...

7. Vapor etching - Wikipedia

   en.wikipedia.org/wiki/Vapor_etching

   Vapor etching refers to a process used in the fabrication of Microelectromechanical systems (MEMS) and Nanoelectromechanical systems (NEMS). Sacrificial layers are isotropically etched using gaseous acids such as Hydrogen fluoride and Xenon difluoride to release the free standing components of the device.