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In engineering, a bottleneck is a phenomenon by which the performance or capacity of an entire system is severely limited by a single component. The component is sometimes called a bottleneck point. The term is metaphorically derived from the neck of a bottle, where the flow speed of the liquid is limited by its neck.
The bottleneck has the lowest throughput of all parts of the transaction path. [1] System designers try to avoid bottlenecks through direct effort towards locating and tuning existing bottlenecks in a software application. Some examples of engineering bottlenecks that appear include the following: a processor, a communication link, and disk IO. [2]
The reliability test duration assures the device's adequate lifetime requirement. For example, with an activation energy of 0.7 eV, 125 °C stress temperature and 55 °C use temperature, the acceleration factor (Arrhenius equation) is 78.6. This means that 1,000 hours' stress duration is equivalent to 9 years of use.
CPU-Z is a freeware system profiling and monitoring application for Microsoft Windows and Android that detects the central processing unit, RAM, motherboard chipset, and other hardware features of a modern personal computer or Android device.
As CPU speeds increased, a bottleneck eventually emerged between the processor and the motherboard, due to limitations caused by data transmission between the CPU and southbridge. Accordingly, starting with the Intel 5 Series , a new architecture was used where some functions of the north and south bridge chips were moved to the CPU, and others ...
A stress test (sometimes called a torture test) of hardware is a form of deliberately intense and thorough testing used to determine the stability of a given system or entity. It involves testing beyond normal operational capacity , often to a breaking point, in order to observe the results.
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Under the Hub Architecture, a motherboard would have a two piece chipset consisting of a northbridge chip and a southbridge chip. Over time, the speed of CPUs kept increasing but the bandwidth of the front-side bus (FSB) (connection between the CPU and the motherboard) did not, resulting in a performance bottleneck. [2]