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Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver (to make silver-gilt), by a chemical or electrochemical (electroplating) process.
Gold-filled is a type of composite material. Composites are formed from two or more constituent materials with different properties that, when combined, create a new material with enhanced properties. [1] Gold-filled material is made by bonding a layer of gold alloy to a base metal core (typically brass, but sometimes copper or silver).
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
The operator dips the brush in plating solution and then applies it to the item, moving the brush continually to get an even distribution of the plating material. Brush electroplating has several advantages over tank plating, including portability, the ability to plate items that for some reason cannot be tank plated (one application was the ...
George Richards Elkington (1801–1865), known for his patent for the electroplating of silver and gold (1840), had patented at least one electrochemical metal coloring process ( his procedure was further elaborated and perfected by the American J.E. Stareck 1937.
The chemical reaction for the dissolution of gold, the "Elsner equation", follows: 4 Au + 8 NaCN + O 2 + 2 H 2 O → 4 Na[Au(CN) 2] + 4 NaOH. Potassium cyanide and calcium cyanide are sometimes used in place of sodium cyanide. Gold is one of the few metals that dissolves in the presence of cyanide ions and oxygen.
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