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There are several types of gold plating used in the electronics industry: [3] Soft, pure gold plating is used in the semiconductor industry. The gold layer is easily soldered and wire bonded. Its Knoop hardness ranges between 60 and 85. The plating baths have to be kept free of contamination. Soft, pure gold is deposited from special electrolytes.
Gold-filled is a type of composite material. Composites are formed from two or more constituent materials with different properties that, when combined, create a new material with enhanced properties. [1] Gold-filled material is made by bonding a layer of gold alloy to a base metal core (typically brass, but sometimes copper or silver).
For the 1996 Summer Olympics, Erie Plating Company provided metal finishing services for the 10,000+ Olympic torches manufactured by the American Meter Company, also headquartered in Erie, Pennsylvania. Each torch weighed about 3.5 pounds (1.6 kg) and was made primarily of aluminum, with a Georgia pecan wood handle and gold ornamentation. [10] [11]
The gold(III) chloride can also be dissolved in water in electroless plating wherein the gold is slowly reduced out of solution onto the surface to be gilded. When this technique is used on the second surface of glass and backed with silver, it is known as " Angel gilding ".
George Richards Elkington (1801–1865), known for his patent for the electroplating of silver and gold (1840), had patented at least one electrochemical metal coloring process ( his procedure was further elaborated and perfected by the American J.E. Stareck 1937.
Since no gold is added, only an object made of an alloy that already contains gold can be depletion gilded. Depletion gilding relies on the fact that gold is highly resistant to oxidation or corrosion by most common chemicals, whereas many other metals are not. Depletion gilding is most often used to treat alloys of gold with copper or silver ...
The operator dips the brush in plating solution and then applies it to the item, moving the brush continually to get an even distribution of the plating material. Brush electroplating has several advantages over tank plating, including portability, the ability to plate items that for some reason cannot be tank plated (one application was the ...
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
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