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  2. Electroless nickel-phosphorus plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    This creates an even layer of metal regardless of the geometry of the surface – in contrast to electroplating which suffers from uneven current density due to the effect of substrate shape on the electric resistance of the bath and therefore on the current distribution within it. [2] Moreover, it can be applied to non-conductive surfaces.

  3. Electroless deposition - Wikipedia

    en.wikipedia.org/wiki/Electroless_deposition

    Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [19]

  4. Electroplating - Wikipedia

    en.wikipedia.org/wiki/Electroplating

    Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current.

  5. Plating - Wikipedia

    en.wikipedia.org/wiki/Plating

    In electroplating, an ionic metal is supplied with electrons to form a non-ionic coating on a substrate.A common system involves a chemical solution with the ionic form of the metal, an anode (positively charged) which may consist of the metal being plated (a soluble anode) or an insoluble anode (usually carbon, platinum, titanium, lead, or steel), and finally, a cathode (negatively charged ...

  6. Copper electroplating - Wikipedia

    en.wikipedia.org/wiki/Copper_electroplating

    Copper electroplating baths can be used to plate either a strike or flash coating, which is a thin highly-adherent initial layer that is plated with additional layers of metal and that serves to improve adhesion of the subsequent layers to the underlying substrate, or a thicker coating of copper that may serve as the finish layer or as a ...

  7. Electroless nickel-boron plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel-boron...

    Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...

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