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  2. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Online heat sink calculators from companies such as Novel Concepts, Inc. and at www.heatsinkcalculator.com [7] can accurately estimate forced and natural convection heat sink performance. For more complex heat sink geometries, or heat sinks with multiple materials or multiple fluids, computation fluid dynamics (CFD) analysis is recommended (see ...

  3. Thermally conductive pad - Wikipedia

    en.wikipedia.org/wiki/Thermally_conductive_pad

    In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).

  4. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  5. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Heatsink mounted on a motherboard, cooling the CPU underneath it. This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power ( TDP ), also known as thermal design point , is the maximum amount of heat that a computer component (like a CPU , GPU or system on a chip ) can generate and that its cooling ...

  6. Logarithmic mean temperature difference - Wikipedia

    en.wikipedia.org/wiki/Logarithmic_mean...

    In a cross-flow, in which one system, usually the heat sink, has the same nominal temperature at all points on the heat transfer surface, a similar relation between exchanged heat and LMTD holds, but with a correction factor. A correction factor is also required for other more complex geometries, such as a shell and tube exchanger with baffles.

  7. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.

  8. 'Fly 1,500 miles home with me to vote': These Americans are ...

    www.aol.com/lifestyle/fly-1-500-miles-home...

    She told her TikTok audience that she had applied for an absentee ballot on Oct. 4 but still hadn’t received it two weeks later. Ultimately, she decided it was important enough to go in person.

  9. Heat pump and refrigeration cycle - Wikipedia

    en.wikipedia.org/wiki/Heat_pump_and...

    Thermodynamic heat pump cycles or refrigeration cycles are the conceptual and mathematical models for heat pump, air conditioning and refrigeration systems. [1] A heat pump is a mechanical system that transmits heat from one location (the "source") at a certain temperature to another location (the "sink" or "heat sink") at a higher temperature. [2]

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