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  2. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  3. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Radial Heat Sink with Thermal Profile and Swirling Forced Convection Flow Trajectories (using CFD analysis) Pin Fin Heat Sink with Thermal Profile and Dione Convection Flow Trajectories (using CFD analysis) Heat sink in a workstation computer An artist's impression of a motherboard heat sink, rendered using POV-Ray Free convection ...

  4. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Rca (°C/W) = Thermal resistance of the Heat sink, between the case of the CPU and the ambient air. Tc = Maximum allowed temperature of the CPU's case (ensuring full performances). Ta = Maximum expected ambient temperature at the inlet of the Heat sink fan. All these parameters are linked together by the following equation:

  5. Why is my computer so slow? - AOL

    www.aol.com/products/blog/why-is-my-computer-so-slow

    Software conflicts: ... such as a faulty motherboard, power supply unit (PSU) or peripheral device (e.g., mouse, keyboard), ... vents and heat sinks to prevent overheating and performance degradation.

  6. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.

  7. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  8. Motherboard - Wikipedia

    en.wikipedia.org/wiki/Motherboard

    This typically requires the use of a low-power CPU, as well as a careful layout of the motherboard and other components to allow for heat sink placement. A 2003 study found that some spurious computer crashes and general reliability issues, ranging from screen image distortions to I/O read/write errors, can be attributed not to software or ...

  9. AOL Mail

    mail.aol.com

    Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!