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2. Pressure-sensitive adhesive - Wikipedia

   en.wikipedia.org/wiki/Pressure-sensitive_adhesive

   Adhesives may be broadly divided in two classes: structural and pressure-sensitive. To form a permanent bond, structural adhesives harden via processes such as evaporation of solvent (for example, white glue), reaction with UV radiation (as in dental adhesives), chemical reaction (such as two part epoxy), or cooling (as in hot melt).

3. Chemistry of pressure-sensitive adhesives - Wikipedia

   en.wikipedia.org/wiki/Chemistry_of_pressure...

   The pressure applied to the tape allows the tape to have better contact with the surface and allows the physical forces between the two to build up. Usually, increased application pressure increases the bond of the adhesive to the substrate. PSA tape laboratory testing is often conducted with a 2 kg roller to increase test uniformity. [13]

4. Pressure-sensitive tape - Wikipedia

   en.wikipedia.org/wiki/Pressure-sensitive_tape

   Pressure-sensitive tape with adhesive on both sides of the carrier material. Gapping. Openings between layers of tape within a roll. Release coating. A very thin coating applied to the impervious tape backing so as to allow the tape to be unwound at a controlled level. Substrate. The substrate is the material to which the PSA tape must adhere ...

5. List of adhesive tapes - Wikipedia

   en.wikipedia.org/wiki/List_of_adhesive_tapes

   This is a marking tape used in the theater, film and television industry to mark areas on a stage for actors. Wound closure strip A medical tape (3M trademark). Surgical tape A medical tape. Stretch-release adhesive Adhesive type manufactured by 3M. Tear tape Allows for easy opening of fast-moving consumer goods. May also carry brand messaging ...

6. Dicing tape - Wikipedia

   en.wikipedia.org/wiki/Dicing_tape

   Dicing tape can be made of PVC, polyolefin, or polyethylene backing material with an adhesive to hold the wafer or substrate in place. In some cases dicing tape will have a release liner that will be removed prior to mounting the tape to the backside of the wafers, with a variety of adhesive strengths, designed for various wafer/substrate sizes and materials.

7. Adhesive bonding - Wikipedia

   en.wikipedia.org/wiki/Adhesive_bonding

   The disadvantage of the lack of instantaneous bonding exhibited by many adhesives can be overcome by using a suitable fast-curing adhesive or a combination of a standard adhesive with a second, fast-curing adhesive (e.g. double-sided adhesive tape) or with another joining method, such as spot welding, rivets, screws, or clinching / press ...