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Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]
The impact factor (IF) or journal impact factor (JIF) of an academic journal is a scientometric index calculated by Clarivate that reflects the yearly mean number of citations of articles published in the last two years in a given journal, as indexed by Clarivate's Web of Science.
Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be ...
The success or failure of the bond is based on measuring the applied force, the failure type due to the applied force and the visual appearance of the residual medium used. A development in bond strength testing of adhesively bonded composite structures is laser bond inspection (LBI). LBI provides a relative strength quotient derived from the ...
Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common.
The resonators are encapsulated either by bonding cover wafers onto the resonator wafers or by depositing thin film encapsulation layers over the resonators. Here again, both methods are used commercially. Bonded cover wafers must be attached with an adhesive. Two options are used, a glass frit bond ring or a metallic bond ring.
Anisotropic conductive film (ACF) is an adhesive interconnect system that is commonly used in panel display manufacturing, including liquid crystal displays (LCD) and organic light-emitting diode (OLED) technology. In display manufacturing, ACF facilitates the electrical and mechanical connections between the driver electronics and substrates.
A graph depicting the strength of forces as the stress required to debond materials increases. The positive trend seen shows as bonding increases, the force and stress required to debond the material does as well. The strength of the bond between the oxide and metal for the same nominal contact area can range from Pa to GPa stresses.