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The Administration on Aging (AoA) is an agency within the Administration for Community Living of the United States Department of Health and Human Services.AoA works to ensure that older Americans can stay independent in their communities, mostly by awarding grants to States, Native American tribal organizations, and local communities to support programs authorized by Congress in the Older ...
There are also many boards, commissions and offices, [1] including: Abraham Lincoln Presidential Library and Museum; Attorney Registration & Disciplinary Commission of the Supreme Court of Illinois
Older Americans Act of 1965: Long title: To provide assistance in the development of new or improved programs to help older persons through grants to the States for community planning and services and for training, through research, development, or training project grants, and to establish within the Department of Health, Education, and Welfare an operating agency to be designated as the ...
It is used to deposit copper and other conductors in forming printed circuit boards and copper interconnects in integrated circuits. It is also used to purify metals such as copper. The aforementioned electroplating of metals uses an electroreduction process (that is, a negative or cathodic current is on the working
Electroplating of zinc was invented in 1800 but the first bright deposits were not obtained until the early 1930s with the alkaline cyanide electrolyte. Much later, in 1966, the use of acid chloride baths improved the brightness even further. The latest modern development occurred in the 1980s, with the new generation of alkaline, cyanide-free ...
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Excluding the continuous strip plating industry, copper is the second most commonly-plated metal after nickel. [6] Copper electroplating offers a number of advantages over other plating processes, including low metal cost, high-conductivity and high-ductility bright finish, and high plating efficiency.
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]