Search results
Results from the WOW.Com Content Network
Ball grid array. A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins ...
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package).
Flip chip. Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.
The Game of Life, also known simply as Conway's Game of Life or simply Life, is a cellular automaton devised by the British mathematician John Horton Conway in 1970. [1] It is a zero-player game, [2][3] meaning that its evolution is determined by its initial state, requiring no further input. One interacts with the Game of Life by creating an ...
This image actually shows two Karnaugh maps: for the function ƒ, using minterms (colored rectangles) and for its complement, using maxterms (gray rectangles). In the image, E () signifies a sum of minterms, denoted in the article as . The Karnaugh map (KM or K-map) is a method of simplifying Boolean algebra expressions.
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. The packaging stage is followed by testing of the ...
The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer-level package (WLP) or a wafer-level chip-scale ...
Finite-difference time-domain (FDTD) or Yee's method (named after the Chinese American applied mathematician Kane S. Yee, born 1934) is a numerical analysis technique used for modeling computational electrodynamics (finding approximate solutions to the associated system of differential equations). Since it is a time-domain method, FDTD ...