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For example, polyglycols from the solder flux can enter the board and increase its humidity intake, with corresponding deterioration of dielectric and corrosion properties. [5] Multi-layer substrates using ceramics suffer from many of the same problems.
Not to be confused with Printed electronics. "PC board" redirects here. For the mainboard of personal computers, see Motherboard. "Panelization" redirects here. For the page layout strategy, see N-up. Printed circuit board of a DVD player Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the conductive traces, the through-hole paths to the other surface, and ...
The principle of four-layer p–n–p–n switching was developed by Moll, Tanenbaum, Goldey, and Holonyak of Bell Laboratories in 1956. [1] The practical demonstration of silicon controlled switching and detailed theoretical behavior of a device in agreement with the experimental results was presented by Dr Ian M. Mackintosh of Bell ...
A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...
Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB). It may be within the resin or at the resin to fiberglass interface.
For example, reverse engineering a circuit assembly reveals whether or not the fabricator has exactly matched the design specifications of the board. The process can be used to inspect for counterfeit or malicious circuits embedded in a PCB, or, if a new product has been purchased by a company, to create schematics or other documentation that ...
The entire 600 V was dropped across the device, and a large short-circuit current flowed. The devices successfully withstood this severe condition. This was the first demonstration of so-called "short-circuit-withstanding-capability" in IGBTs. Non-latch-up IGBT operation was ensured, for the first time, for the entire device operation range. [22]
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