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The MediaTek Dimensity 1100 and 1200 were announced on December 1, 2020, as the chipset company announced. ... Dimensity 9300+ ... Release AIoT i300A [122] ...
MediaTek Dimensity 7200, 9200, Qualcomm Snapdragon 8 Gen 2: Cortex-X1: Google Tensor, Tensor G2, Qualcomm Snapdragon 888(+), Samsung Exynos 2100: Cortex-X2: MediaTek Dimensity 9000, Qualcomm Snapdragon 7+ Gen 2, 8(+) Gen 1, Samsung Exynos 2200: Cortex-X3: MediaTek Dimensity 9200, Qualcomm Snapdragon 8 Gen 2: Cortex-X4: MediaTek Dimensity 9300 ...
On November 26, 2019, MediaTek announced their 5G SoC Dimensity 1000, the world's first mobile SoC supporting AV1. [59] On November 6, 2023, MediaTek announced their newest flagship chip, the Dimensity 9300. Besides an increase in performance and battery life, the newest chipset boasts to be AI-generative ready as well. [60]
With a 1.5K 120Hz LTPO AMOLED display, an IP68 + IP69 rating, and a huge 5910 mAh battery that is bigger than the Find X7 Ultra, this phone is the first in India to feature the MediaTek Dimensity 9400 SoC. [19] [20] This time, Oppo chose to adopt the MediaTek chipset, which includes the most recent MediaTek Dimensity 9400.
MT6895/MT6895Z/MT6896 (Dimensity 8000/8100/8200) Mali-G610 MC6 @ 700/860/950 MHz Dimensity 8300 Mali-G615 MC6 MT6983 (Dimensity 9000/9000+) Mali-G710 MP10 @ 848/950 MHz MT6985 (Dimensity 9200/9200+) Immortalis-G715 MP11 @ 981/1150 MHz MT6989 (Dimensity 9300) Immortalis-G720 MP12 @ 1.3 GHz Dimensity 9400 Immortalis-G925 MP12 NetLogic
UNISOC (Chinese: 紫光展锐; pinyin: Zǐguāng zhǎn ruì), formerly Spreadtrum Communications, Inc. (Chinese: 展讯通信有限公司; pinyin: Zhǎnxùn Tōngxìn Yǒuxiàn Gōngsī), is a Chinese fabless semiconductor company headquartered in Shanghai which produces chipsets for mobile phones.
Apple A13 Bionic General information Launched September 10, 2019 Designed by Apple Inc. Common manufacturer TSMC Max. CPU clock rate to 2.65 GHz Cache L2 cache 8 MB (performance cores) 4 MB (efficient cores) Last level cache 16 MB (system cache) Architecture and classification Application Mobile Technology node 7 nm+ (N7P) Microarchitecture "Lightning" and "Thunder" Instruction set A64 ARMv8.4 ...
The back panel and sides are made of frosted plastic.. Unlike its predecessors, the A34 lacks one camera; thus having 3 cameras on the back and 1 on the front. The back of the smartphone is similar to the Samsung Galaxy A54 5G.