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Intel i945GC northbridge with Pentium Dual-Core microprocessor. This article provides a list of motherboard chipsets made by Intel, divided into three main categories: those that use the PCI bus for interconnection (the 4xx series), those that connect using specialized "hub links" (the 8xx series), and those that connect using PCI Express (the 9xx series).
Mobile PCI Express Module (MXM) is an interconnect standard for GPUs (MXM Graphics Modules) in laptops using PCI Express created by MXM-SIG. The goal was to create a non-proprietary, industry standard socket, so one could easily upgrade the graphics processor in a laptop, without having to buy a whole new system or relying on proprietary vendor upgrades.
PCI Express Mini Card (also known as Mini PCI Express, Mini PCIe, Mini PCI-E, mPCIe, and PEM), based on PCI Express, is a replacement for the Mini PCI form factor. It is developed by the PCI-SIG . The host device supports both PCI Express and USB 2.0 connectivity, and each card may use either standard.
The specification would be based on the PCI Express interface and NVM Express protocol. On 18 April 2017 the CompactFlash Association published the CFexpress 1.0 specification. [2] Version 1.0 will use the XQD form-factor (38.5 mm × 29.8 mm × 3.8 mm) with two PCIe 3.0 lanes for speeds up to 2 GB/s. NVMe 1.2 is used for low-latency access, low ...
Originally developed by the Personal Computer Memory Card International Association (), the ExpressCard standard is maintained by the USB Implementers Forum ().The host device supports PCI Express, USB 2.0 (including Hi-Speed), and USB 3.0 (SuperSpeed) [2] (ExpressCard 2.0 only) connectivity through the ExpressCard slot; cards can be designed to use any of these modes.
The PCI-X standard was developed jointly by IBM, HP, and Compaq and submitted for approval in 1998. It was an effort to codify proprietary server extensions to the PCI local bus to address several shortcomings in PCI, and increase performance of high bandwidth devices, such as Gigabit Ethernet, Fibre Channel, and Ultra3 SCSI cards, and allow processors to be interconnected in clusters.
The physical phenomena on which the device relies (such as spinning platters in a hard drive) will also impose limits; for instance, no spinning platter shipping in 2009 saturates SATA revision 2.0 (3 Gbit/s), so moving from this 3 Gbit/s interface to USB 3.0 at 4.8 Gbit/s for one spinning drive will result in no increase in realized transfer rate.
It specified 3.3 V signals and 1× and 2× speeds. [4] Specification 2.0 documented 1.5 V signaling, which could be used at 1×, 2× and the additional 4× speed [14] [15] and 3.0 added 0.8 V signaling, which could be operated at 4× and 8× speeds. [16] (1× and 2× speeds are physically possible, but were not specified.)