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The processor is affixed to the motherboard by soldering the balls to the motherboard. This is thinner than a pin grid array socket arrangement, but is not removable. The 479 balls of the Micro-FCBGA package (a package almost identical to the 478-pin socketable micro-FCPGA package) are arranged as the 6 outer rings of a 1.27 mm pitch (20 balls ...
LGA 1700 socket on a motherboard.. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]
Certain devices use Ball Grid Array (BGA) sockets, although these require soldering and are generally not considered user replaceable. CPU sockets are used on the motherboard in desktop and server computers. Because they allow easy swapping of components, they are also used for prototyping new circuits.
Solder joint dimensions in SMT quickly become much smaller as advances are made toward ultra-fine pitch technology. The reliability of solder joints becomes more of a concern as less and less solder is allowed for each joint. Voiding is a fault commonly associated with solder joints, especially when reflowing a solder paste in the SMT application.
Not to be confused with Printed electronics. For other uses, see PCB (disambiguation). "PC board" redirects here. For the mainboard of personal computers, see Motherboard. "Panelization" redirects here. For the page layout strategy, see N-up. Printed circuit board of a DVD player Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the conductive traces, the ...
Dispensed solder paste on the pads of a QFPs Mask and spheres for reballing. Heating a single SMD with a hot-air gun to melt all solder joints between it and the PCB is usually the first step, followed by removing the SMD while the solder is molten. The pad array on the conductor board should then be cleaned of old solder.
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Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...
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