Search results
Results from the WOW.Com Content Network
Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]
With the growing use of bonding technology in industry and professional trades, and the resulting, increasing demands on the quality and durability of glued products, comprehensive national and international standards have been developed for, amongst other things, the characterisation, classification and testing of adhesives and adhesive bonds.
Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILEX) film carrier. This FPC with the die(s) (TAB inner lead bonding, ILB) can be mounted on the system ...
Wafer bond characterization refers to the process of evaluating the quality and strength of a bond between two semiconductor wafers. The wafer bond characterization is based on different methods and tests. Considered a high importance of the wafer are the successful bonded wafers without flaws.
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS ...
The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...
Glob-top is a variant of conformal coating used in chip-on-board assembly (COB). It consists of a drop of specially formulated epoxy [4] or resin deposited over a semiconductor chip and its wire bonds, to provide mechanical support and exclude contaminants such as fingerprint residues which could disrupt circuit operation. It is most commonly ...
Mucoadhesion involves several types of bonding mechanisms, and it is the interaction between each process that allows for the adhesive process. The major categories are wetting theory, adsorption theory, diffusion theory, electrostatic theory, and fracture theory. [5]