enow.com Web Search

Search results

1. Results from the WOW.Com Content Network

2. Heat sink - Wikipedia

   en.wikipedia.org/wiki/Heat_sink

   A heat sink design must fulfill both its thermal as well as its mechanical requirements. Concerning the latter, the component must remain in thermal contact with its heat sink with reasonable shock and vibration. The heat sink could be the copper foil of a circuit board, or a separate heat sink mounted onto the component or circuit board.

3. Thermal management (electronics) - Wikipedia

   en.wikipedia.org/wiki/Thermal_management...

   CPU heat sink with fan attached A heat sink (aluminium) incorporating a heat pipe (copper) All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. [1]

4. Computer cooling - Wikipedia

   en.wikipedia.org/wiki/Computer_cooling

   A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan. Vertical aluminium ...

5. Electronics cooling - Wikipedia

   en.wikipedia.org/wiki/Electronics_cooling

   Electronics cooling encompasses thermal design, analysis and experimental characterization of electronic systems as a discrete discipline with the product creation process for an electronics product, or an electronics sub-system within a product (e.g. an engine control unit (ECU) for a car).

6. Thermal interface material - Wikipedia

   en.wikipedia.org/wiki/Thermal_interface_material

   A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

7. Computer fan - Wikipedia

   en.wikipedia.org/wiki/Computer_fan

   To cool these components, fans are used to move heated air away from the components and draw cooler air over them. Fans attached to components are usually used in combination with a heat sink to increase the area of heated surface in contact with the air, thereby improving the efficiency of cooling. Fan control is not always an automatic ...

8. 2 dead after plane crashed into building near Honolulu ...

   www.aol.com/2-dead-plane-crashed-building...

   Two people are dead after a plane crashed into a building near the Daniel K. Inouye International Airport in Honolulu, according to reports. At around 3 p.m. local time on Tuesday, a small plane ...

9. Thermal design power - Wikipedia

   en.wikipedia.org/wiki/Thermal_design_power

   Heatsink mounted on a motherboard, cooling the CPU underneath it. This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is ...