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The PSP's main microprocessor is a multifunction device named "Allegrex" that includes a 32-bit MIPS32 R4k-based CPU (Little Endian), a Floating Point Unit, and a Vector Floating Point Unit. Additionally, there is a processor block known as "Media Engine" that contains another 32-bit MIPS32 R4k-base CPU, hardware for multimedia decoding (such ...
The PlayStation Portable [a] (PSP) is a handheld game console developed and marketed by Sony Computer Entertainment.It was first released in Japan on December 12, 2004, in North America on March 24, 2005, and in PAL regions on September 1, 2005, and is the first handheld installment in the PlayStation line of consoles.
The microprocessor was manufactured by LSI Logic Corp. with technology licensed from SGI. Features: Initial feature size (process node) was 0.5 micron (500 nm). [3] 850k – 1M transistors [4] Operating performance: 30 MIPS [5] Bus bandwidth 132 MB/s [6] One arithmetic/logic unit (ALU) One shifter; CPU cache RAM: 4 KB instruction cache [2]
CPU MIPS R4000 at 1~333 MHz RAM 32 MB 64 MB [2] Internal storage 32 MB; reserved for system software 64 MB; reserved for system software 16 GB; shared between user and system software 64 MB; reserved for system software Connectivity USB 2.0, UMD, serial port, headphone jack, Memory Stick PRO Duo
Actual Remote Play between the PSP and the PS3 games are only supported by a "select" very few PS3 titles. Furthermore, PSP-2000, PSP-3000, and PSP-N1000 can use the Skype VoIP service starting with system software version 3.90. The service allows Skype calls to be made over Wi-Fi and on the PSP Go over the Bluetooth Modem feature. It is not ...
The PSP is an integral part of the boot process, without which the x86 cores would never be activated. On-chip phase Firmware located directly on the PSP chip sets up the ARM CPU, verifies the integrity of the SPI ROM, using various data structures locates the off-chip firmware (AGESA) from the SPI ROM, and copies it over to internal PSP memory.
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In 2001, a Toshiba research team including T. Imoto, M. Matsui and C. Takubo developed a "System Block Module" wafer bonding process for manufacturing 3D integrated circuit (3D IC) packages. [4] [5] The earliest known commercial use of a 3D package-on-package chip was in Sony's PlayStation Portable (PSP) handheld game console, released