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Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Electroless nickel-phosphorus plating, also referred to as E-nickel, is a chemical process that deposits an even layer of nickel-phosphorus alloy on the surface of a solid substrate, like metal or plastic.
Other platings used are organic solderability preservative (OSP), immersion silver (IAg), immersion tin (ISn), electroless nickel immersion gold (ENIG) coating, electroless nickel electroless palladium immersion gold (ENEPIG), and direct gold plating (over nickel).
The finish is thick and tends to be subject to defects such as bubbles. ... For silicone resin, the coating thickness recommended by the IPC standards is 50–210 μm ...
With technological advancement deposits up to .025" have been achieved and retained uniformity. Disadvantages compared to tank plating can include greater operator involvement (tank plating can frequently be done with minimal attention and the solutions used are often toxic), and the inconsistency in achieving as great a plate thickness.
The 'Beverly Hills: 90210' star and ex Dean McDermott share five kids — Liam, Stella, Hattie, Finn and Beau
Some troops leave the battlefield injured. Others return from war with mental wounds. Yet many of the 2 million Iraq and Afghanistan veterans suffer from a condition the Defense Department refuses to acknowledge: Moral injury.
Schauffele had 15 finishes in the top 10 out of his 21 starts in individual play on the PGA Tour. From May until the end of the season, he went 11 straight events no worse than 15th.