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The heart of NIST's next-generation miniature atomic clock -- ticking at high "optical" frequencies-- is this vapor cell on a chip, shown next to a coffee bean for scale. Conventional vapor cell atomic clocks are about the size of a deck of cards, consume about 10 W of electrical power and cost about $3,000.
Sony's 16 Mb SRAM memory chip in 1994. [47] NEC VR4300 (1995), used in the Nintendo 64 game console. Intel Pentium Pro (1995), Pentium (P54CS, 1995), and initial Pentium II CPUs (Klamath, 1997). AMD K5 (1996) and original AMD K6 (Model 6, 1997) CPUs. Parallax Propeller, 8 core microcontroller. [100]
Reducing the size and power consumption of optical clocks is necessary to enable their use in geodesy and GPS navigation. In August 2004, NIST scientists demonstrated a chip-scale atomic clock that was 100 times smaller than an ordinary atomic clock and had a much smaller power consumption of 125 mW.
Cutler worked at Hewlett-Packard Laboratories (1957–1999), where he developed oscillators, atomic frequency standards and designed atomic chronometers. In 1999, he went on to work at Agilent Technologies, a spin-off from H-P, where he developed quartz oscillators, atomic clocks, and used the Global Positioning System to synchronize clocks worldwide. [3]
Wafer-level chip-scale package: A WL-CSP or WLCSP package is just a bare die with a redistribution layer (or I/O pitch) to rearrange the pins or contacts on the die so that they can be big enough and have sufficient spacing so that they can be handled just like a BGA package. [19] PMCP: Power mount CSP (chip-scale package) Variation of WLCSP ...
Semiconductor device modeling creates models for the behavior of semiconductor devices based on fundamental physics, such as the doping profiles of the devices. It may also include the creation of compact models (such as the well known SPICE transistor models), which try to capture the electrical behavior of such devices but do not generally ...
Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC 's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology , in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct ...
Molecular electronics [6] is a technology under development brings hope for future atomic-scale electronic systems. A promising application of molecular electronics was proposed by the IBM researcher Ari Aviram and the theoretical chemist Mark Ratner in their 1974 and 1988 papers Molecules for Memory, Logic and Amplification (see unimolecular ...