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  2. Application-specific integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Application-specific...

    An application-specific integrated circuit (ASIC / ˈ eɪ s ɪ k /) is an integrated circuit (IC) chip customized for a particular use, rather than intended for general-purpose use, such as a chip designed to run in a digital voice recorder or a high-efficiency video codec. [1]

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.

  4. CHIPS and Science Act - Wikipedia

    en.wikipedia.org/wiki/CHIPS_and_Science_Act

    The CHIPS and Science Act is a U.S. federal statute enacted by the 117th United States Congress and signed into law by President Joe Biden on August 9, 2022. The act authorizes roughly $280 billion in new funding to boost domestic research and manufacturing of semiconductors in the United States, for which it appropriates $52.7 billion.

  5. Very-large-scale integration - Wikipedia

    en.wikipedia.org/wiki/Very-large-scale_integration

    Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit (metal oxide semiconductor) chips were developed and then widely adopted, enabling complex semiconductor and telecommunications technologies.

  6. 7 nm process - Wikipedia

    en.wikipedia.org/wiki/7_nm_process

    The Exynos 9825 is the first mass market chip built featuring EUVL. [48] On September 6, 2019, Huawei announced their HiSilicon Kirin 990 4G & 990 5G SoCs, built using TSMC's N7 and N7+ processes. [49] On September 10, 2019, Apple announced their A13 Bionic chip used in iPhone 11 and iPhone 11 Pro built using TSMC's 2nd gen N7P process. [50]

  7. Integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit

    The first application MOS chips were small-scale integration (SSI) chips. [109] Following Mohamed M. Atalla 's proposal of the MOS integrated circuit chip in 1960, [ 110 ] the earliest experimental MOS chip to be fabricated was a 16-transistor chip built by Fred Heiman and Steven Hofstein at RCA in 1962. [ 49 ]

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  9. List of semiconductor scale examples - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    Apple A12 and Huawei Kirin 980 mobile processors, both released in 2018, use 7 nm chips manufactured by TSMC. [ 127 ] AMD began using TSMC 7 nm starting with the Vega 20 GPU in November 2018, [ 128 ] with Zen 2-based CPUs and APUs from July 2019, [ 129 ] and for both PlayStation 5 [ 130 ] and Xbox Series X/S [ 131 ] consoles' APUs, released ...