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The process used to form DRAM capacitors creates a rough and hilly surface, which makes it difficult to add metal interconnect layers and still maintain good yield. In 1998, state-of-the-art DRAM processes had four metal layers, while state-of-the-art logic processes had seven metal layers. [2]
A circuit diagram (or: wiring diagram, electrical diagram, elementary diagram, electronic schematic) is a graphical representation of an electrical circuit. A pictorial circuit diagram uses simple images of components, while a schematic diagram shows the components and interconnections of the circuit using standardized symbolic representations.
Example of a system context diagram. [1] A system context diagram in engineering is a diagram that defines the boundary between the system, or part of a system, and its environment, showing the entities that interact with it. [2] This diagram is a high level view of a system. It is similar to a block diagram.
Since the 22nm node, some manufacturers have added a new process called middle-of-line (MOL) which connects the transistors to the rest of the interconnect made in the BEoL process. The MOL is often based on tungsten and has upper and lower layers: the lower layer connects the junctions of the transistors, and an upper layer which is a tungsten ...
It was a variation of the TSV process, and was later called SLID (solid liquid inter-diffusion) technology. [ 18 ] The term "through-silicon via" (TSV) was coined by Tru-Si Technologies researchers Sergey Savastiouk, O. Siniaguine, and E. Korczynski, who proposed a TSV method for a 3D wafer-level packaging (WLP) solution in 2000.
The BEOL process deposits metalization layers on the silicion to interconnect the individual devices generated during FEOL (bottom). CMOS fabrication process. Back end of the line or back end of line (BEOL) is a process in semiconductor device fabrication that consists of depositing metal interconnect layers onto a wafer already patterned with devices.
In integrated circuits, optical interconnects refers to any system of transmitting signals from one part of an integrated circuit to another using light. Optical interconnects have been the topic of study due to the high latency and power consumption incurred by conventional metal interconnects in transmitting electrical signals over long distances, such as in interconnects classed as global ...
The same year, a Stanford University research team consisting of Kaustav Banerjee, Shukri J. Souri, Pawan Kapur and Krishna C. Saraswat presented a novel 3D chip design that exploits the vertical dimension to alleviate the interconnect related problems and facilitates heterogeneous integration of technologies to realize a system-on-a-chip (SoC ...