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NEi Nastran - software for engineering simulation of stress, dynamics, and heat transfer in structures. NI Multisim - an electronic schematic capture and simulation program. Orbit, Orbit II, Orbit II Plus, ORION for Windows - Satellite Simulation Software used by the DOD for mission planning, visibility studies, remote sensing studies and ...
SimScale is a computer-aided engineering (CAE) software product based on cloud computing. SimScale was developed by SimScale GmbH and allows computational fluid dynamics, finite element analysis and thermal simulations. [1] [2] The backend of the platform uses open source and proprietary simulation codes. The open source codes include:
Goma is an open-source, parallel, and scalable multiphysics software package for modeling and simulation of real-life physical processes, with a basis in computational fluid dynamics for problems with evolving geometry. It solves problems in all branches of mechanics, including fluids, solids, and thermal analysis.
Finite element software for structural, fluid, heat transfer, electromagnetic, and multiphysics problems, including fluid-structure interaction and thermo-mechanical coupling: Adina R&D: Proprietary commercial software: Autodesk Simulation: Finite Element software of Autodesk: Autodesk: Proprietary commercial software: Windows: ANSYS
The generation of heat is mainly produced by joule heating, this undesired effect has limited the performance of integrated circuits. In the preset article heat conduction was described and analytical and numerical methods to solve a heat transfer problem were presented.
FEATool Multiphysics is a fully integrated physics and PDE simulation environment where the modeling process is subdivided into six steps; preprocessing (CAD and geometry modeling), mesh and grid generation, physics and PDE specification, boundary condition specification, solution, and postprocessing and visualization.
The different parts of Elmer software may be used independently. Whilst the main module is the ElmerSolver tool, which includes many sophisticated features for physical model solving, the additional components are required to create a full workflow. For pre- and post-processing other tools, such as Paraview can be used to visualise the output.
General purpose for research, engineering and educational use, includes AC, DC and Transient Magnetics, Electrostatics, AC and DC Conduction, Transient Electrics, Heat Transfer and multiphysics COMSOL Multiphysics: commercial Yes Yes Yes Yes Yes Automatic FEM, MoM, BPM, ray tracing: General purpose FEKO: commercial Yes Yes Yes Yes Yes