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Metal fabrication is the creation of metal structures by cutting, bending and assembling processes. It is a value-added [1] process involving the creation of machines, parts, and structures from various raw materials. Typically, a fabrication shop bids on a job, usually based on engineering drawings, and if awarded the contract, builds the ...
Forging temperature is the temperature at which a metal becomes substantially more soft, but is lower than the melting temperature, such that it can be reshaped by forging. [1] Bringing a metal to its forging temperature allows the metal's shape to be changed by applying a relatively small force, without creating cracks.
(MDMT) M is the lowest temperature permitted according to the metallurgy of the vessel fabrication materials and the thickness of the vessel component, that is, according to the low temperature embrittlement range and the charpy impact test requirements per temperature and thickness, for each one of the vessel's components.
Galvanized fumes are released when the galvanized metal reaches a certain temperature. This temperature varies by the galvanization process used. In long-term, continuous exposure, the recommended maximum temperature for hot-dip galvanized steel is 200 °C (392 °F), according to the American Galvanizers Association.
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Rapid thermal processing (RTP) is a semiconductor manufacturing process which heats silicon wafers to temperatures exceeding 1,000°C for not more than a few seconds. During cooling wafer temperatures must be brought down slowly to prevent dislocations and wafer breakage due to thermal shock.
The typical efficiency of TEGs is around 5–8%, although it can be higher. Older devices used bimetallic junctions and were bulky. More recent devices use highly doped semiconductors made from bismuth telluride (Bi 2 Te 3), lead telluride (PbTe), [10] calcium manganese oxide (Ca 2 Mn 3 O 8), [11] [12] or combinations thereof, [13] depending on application temperature.
An important consideration is peak temperature, which is the maximum allowable temperature of the entire process. A common peak temperature is 20–40 °C above liquidus. [ 1 ] This limit is determined by the component on the assembly with the lowest tolerance for high temperatures (the component most susceptible to thermal damage).