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Phase-change memory (also known as PCM, PCME, PRAM, PCRAM, OUM (ovonic unified memory) and C-RAM or CRAM (chalcogenide RAM)) is a type of non-volatile random-access memory. PRAMs exploit the unique behaviour of chalcogenide glass .
DDR4 RAM operates at a voltage of 1.2 V and supports frequencies between 800 and 1600 MHz (DDR4-1600 through DDR4-3200). Compared to DDR3, which operates at 1.5 V with frequencies from 400 to 1067 MHz (DDR3-800 through DDR3-2133), DDR4 offers better performance and energy efficiency .
2003 — A 128 kbit MRAM chip was introduced, manufactured with a 180 nm lithographic process; 2004 June — Infineon unveiled a 16-Mbit prototype, manufactured with a 180 nm lithographic process; September — MRAM becomes a standard product offering at Freescale. October — Taiwan developers of MRAM tape out 1 Mbit parts at TSMC.
Development of 3D XPoint began around 2012. [8] Intel and Micron had developed other non-volatile phase-change memory (PCM) technologies previously; [note 1] Mark Durcan of Micron said 3D XPoint architecture differs from previous offerings of PCM, and uses chalcogenide materials for both selector and storage parts of the memory cell that are faster and more stable than traditional PCM ...
Support for up to 8 DIMMs of DDR4 memory, up to 64 GB per DIMM (512 GB). I (such as D-2161I): Integrated Intel Ethernet; T (such as D-2183T): high temperature support or extended reliability offerings; N (such as D-2187NT): Intel Ethernet and Intel QuickAssist Technology [1] Package size: 42.5 × 55 mm
The DDR4 chips run at 1.2 V or less, [18] [19] compared to the 1.5 V of DDR3 chips, and have in excess of 2 billion data transfers per second. They were expected to be introduced at frequency rates of 2133 MHz, estimated to rise to a potential 4266 MHz [ 20 ] and lowered voltage of 1.05 V [ 21 ] by 2013.
The first generation of MRAM, such as Everspin Technologies' 4 Mbit, utilized field-induced writing. The second generation is developed mainly through two approaches: Thermal-assisted switching (TAS) [ 6 ] which is being developed by Crocus Technology , and Spin-transfer torque (STT) which Crocus , Hynix , IBM , and several other companies are ...
A different concept is the processor-memory performance gap, which can be addressed by 3D integrated circuits that reduce the distance between the logic and memory aspects that are further apart in a 2D chip. [39] Memory subsystem design requires a focus on the gap, which is widening over time. [40]
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