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  2. Dice notation - Wikipedia

    en.wikipedia.org/wiki/Dice_notation

    In some games, the above notation is expanded to allow for a multiplier, as in AdX×C or C×dX, where: "×" denotes multiplication, and can be replaced by "/" or "÷" for division.

  3. Die (integrated circuit) - Wikipedia

    en.wikipedia.org/wiki/Die_(integrated_circuit)

    A die can host many types of circuits. One common use case of an integrated circuit die is in the form of a central processing unit (CPU). Through advances in modern technology, the size of the transistor within the die has shrunk exponentially, following Moore's law.

  4. Pentagonal trapezohedron - Wikipedia

    en.wikipedia.org/wiki/Pentagonal_trapezohedron

    Ten ten-sided dice. The pentagonal trapezohedron was patented for use as a gaming die (i.e. "game apparatus") in 1906. [1] These dice are used for role-playing games that use percentile-based skills; however, a twenty-sided die can be labeled with the numbers 0-9 twice to use for percentages instead.

  5. D6 System - Wikipedia

    en.wikipedia.org/wiki/D6_System

    The D6 System is a role-playing game system published by West End Games (WEG) and licensees. While the system is primarily intended for pen-and-paper role-playing games, variations of the system have also been used in live action role-playing games and miniature battle games.

  6. Sicherman dice - Wikipedia

    en.wikipedia.org/wiki/Sicherman_dice

    Crazy dice is a mathematical exercise in elementary combinatorics, involving a re-labeling of the faces of a pair of six-sided dice to reproduce the same frequency of sums as the standard labeling.

  7. Dice - Wikipedia

    en.wikipedia.org/wiki/Dice

    Four traditional dice showing all six different sides. Dice of different sizes being thrown in slow motion. A die (sg.: die or dice; pl.: dice) [1] is a small, throwable object with marked sides that can rest in multiple positions.

  8. Die singulation - Wikipedia

    en.wikipedia.org/wiki/Die_singulation

    Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.

  9. Long dice - Wikipedia

    en.wikipedia.org/wiki/Long_dice

    A four-faced Daldøs die, "unrolled" at right to show one of its standard configurations. Both cubic dice and four-faced long dice are found as early as the mid third millennium BCE at Indus Valley civilisation sites; these are marked variously with dot-and-ring figures, linear devices, and Indus Valley signs. [2]