Search results
Results from the WOW.Com Content Network
Stub Series Terminated Logic (SSTL) is a group of electrical standards for driving transmission lines commonly used with DRAM based DDR memory IC's and memory modules. SSTL is primarily designed for driving the DDR (double-data-rate) SDRAM modules used in computer memory; however, it is also used in other applications, notably some PCI Express PHYs and other high-speed devices.
Significance to digital electronics [ edit ] In Very-Large-Scale Integration (VLSI) integrated circuit microprocessor design and semiconductor fabrication , a process corner represents a three or six sigma variation from nominal doping concentrations (and other parameters [ 2 ] ) in transistors on a silicon wafer .
In semiconductor manufacturing, the 2 nm process is the next MOSFET (metal–oxide–semiconductor field-effect transistor) die shrink after the 3 nm process node.. The term "2 nanometer", or alternatively "20 angstrom" (a term used by Intel), has no relation to any actual physical feature (such as gate length, metal pitch or gate pitch) of the transistors.
Various machine components used in mechanical engineering. Mechanical engineering is the study of physical machines that may involve force and movement. It is an engineering branch that combines engineering physics and mathematics principles with materials science, to design, analyze, manufacture, and maintain mechanical systems. [1]
The process of joining metals using a low melting point filler metal; a critical process in the assembly of most electronic devices. solenoid A coil of wire used to create a magnetic field; often a device with a ferromagnetic plunger that moves when the coil is energized. solid state Electronics that relies on current flow through crystalline ...
A floorplan that consists of a single rectangular block is sliceable. If a block from a sliceable floorplan is cut ("sliced") in two by a vertical or horizontal line, the resulting floorplan is sliceable. Sliceable floorplans have been used in a number of early electronic design automation tools [1] for a number of reasons.
Depaneling or depanelization is a process step in high-volume electronics assembly production. In order to increase the throughput of printed circuit board (PCB) manufacturing and surface mount (SMT) lines, PCBs are often arranged in a process called panelization so that they consist of many smaller individual PCBs that will be used in the ...
There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]