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  2. Flux (metallurgy) - Wikipedia

    en.wikipedia.org/wiki/Flux_(metallurgy)

    In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time. They are used in both extractive metallurgy and metal joining. Some of the earliest known fluxes were sodium carbonate, potash, charcoal, coke, borax, [1] lime, [2] lead sulfide [3] and certain minerals ...

  3. Amalgam (chemistry) - Wikipedia

    en.wikipedia.org/wiki/Amalgam_(chemistry)

    For the alkali metals, amalgamation is exothermic, and distinct chemical forms can be identified, such as KHg and KHg 2. [4] KHg is a gold-coloured compound with a melting point of 178 °C, and KHg 2 a silver-coloured compound with a melting point of 278 °C. These amalgams are very sensitive to air and water, but can be worked with under dry ...

  4. Pewter - Wikipedia

    en.wikipedia.org/wiki/Pewter

    Pewter (/ ˈ p juː t ər /) is a malleable metal alloy consisting of tin (85–99%), antimony (approximately 5–10%), copper (2%), bismuth, and sometimes silver. [1] In the past, it was an alloy of tin and lead , but most modern pewter, in order to prevent lead poisoning , is not made with lead.

  5. Metallurgy - Wikipedia

    en.wikipedia.org/wiki/Metallurgy

    Metallurgy derives from the Ancient Greek μεταλλουργός, metallourgós, "worker in metal", from μέταλλον, métallon, "mine, metal" + ἔργον, érgon, "work" The word was originally an alchemist's term for the extraction of metals from minerals, the ending -urgy signifying a process, especially manufacturing: it was discussed in this sense in the 1797 Encyclopædia ...

  6. Binder (material) - Wikipedia

    en.wikipedia.org/wiki/Binder_(material)

    Glue is traditionally made by the boiling of hoofs, bones, or skin of animals and then mixing the hard gelatinous residue with water. Natural gum-based binders are made from substances extracted from plants. [1] Larger amounts of dry substance are added to liquid binders in order to cast or model sculptures and reliefs. [2]

  7. Adhesive bonding - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding

    Adhesive bonding has the advantage of relatively low bonding temperature as well as the absence of electric voltage and current. Based on the fact that the wafers are not in direct contact, this procedure enables the use of different substrates, e.g. silicon, glass, metals and other semiconductor materials.

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