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Lapping machine. Lapping is a machining process in which two surfaces are rubbed together with an abrasive between them, by hand movement or using a machine. Lapping often follows other subtractive processes with more aggressive material removal as a first step, such as milling and/or grinding. Lapping can take two forms.
The process starts with a standard salt bath nitrocarburizing cycle, which produces a layer of ε iron nitride. [4] Next, the workpiece is mechanically polished; typical polishing processes include vibratory finishing, lapping, and centerless grinding. Finally, the workpiece is re-immersed into the salt quench bath for 20 to 30 minutes, rinsed ...
Polishing is the process of creating a smooth and shiny surface by rubbing it or by applying a chemical treatment, leaving a clean surface with a significant specular reflection (still limited by the index of refraction of the material according to the Fresnel equations). [1]
In the US, the Construction Management Association of America (CMAA) states the most common responsibilities of a Construction Manager fall into the following 7 categories: Project Management Planning, Cost Management, Time Management, Quality Management, Contract Administration, Safety Management, and CM Professional Practice. CM professional ...
This method of polishing can be fine-tuned to give a wide range of finishes, from matte to mirror-bright. Electropolishing also has an advantage over traditional manual polishing in that the finished product will not experience the compression and deformation traditionally associated with the polishing process.
Polishing lines will be soft and less reflective than a #4 architectural finish. #7 Finish. A #7 finish is produced by polishing with a 280–320 grit belt or wheel and sisal buffing with a cut and color compound. This is a semi-bright finish that will still have some polishing lines, but they will be very dull.
The process uses an abrasive and corrosive chemical slurry (commonly a colloid) in conjunction with a polishing pad and retaining ring, typically of a greater diameter than the wafer. The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring.
The process is usually optimized to ensure that the resulting texture is usable. If necessary, an additional process will be added to modify the initial texture. The latter process may be grinding (abrasive cutting) , polishing , lapping , abrasive blasting , honing , electrical discharge machining (EDM), milling , lithography , industrial ...