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Probe Manufacturing is a global electronics design & manufacturing services company providing innovators with business services through our factory in California as well as factories Worldwide.
IRVINE, Calif.--(BUSINESS WIRE)-- Probe Manufacturing, Inc., (OTC QB : PMFI), a global electronics design & manufacturing services company, ranked 9th in the Orange County Business Journal's 2012 ...
Technoprobe was founded in Merate near Milan in 1996 by Giuseppe Crippa, who had developed a new and more rapid method to manufacture probe cards. [2] As the company grew, it opened manufacturing and sales offices abroad, including in Rousset, France (2001), Singapore (2003), San Jose, California (2007), Philippines (2010), Korea (2015), and Japan (2018).
Probe cards are broadly classified into needle type, vertical type, and MEMS (Micro Electro-Mechanical System) [4] type depending on shape and forms of contact elements. MEMS type is the most advanced technology currently available. The most advanced type of probe card currently can test an entire 12" wafer with one touchdown.
Probe Manufacturing Secures $250,000 Manufacturing Contract from a Leading Sensing Device Manufacturer and Supplier IRVINE, Calif.--(BUSINESS WIRE)-- Probe Manufacturing, Inc., (OTC QB : PMFI), a ...
Semiconductor device manufacturing has since spread from Texas and California in the 1960s to the rest of the world, including Asia, Europe, and the Middle East. Wafer size has grown over time, from 25 mm (1 inch) in 1960, to 50 mm (2 inches) in 1969, 100 mm (4 inches) in 1976, 125 mm (5 inches) in 1981, 150 mm (6 inches) in 1983 and 200 mm in ...
Probe Manufacturing Reports 2012 Year End Financial Results; Year-Over-Year Revenue Growth Continues IRVINE, Calif.--(BUSINESS WIRE)-- Probe Manufacturing, Inc. ("PMI"), (OTC QB : PMFI), a global ...
The soldering process that forms the bead probe leaves a coating of flux. Depending on the manufacturing process used, this flux can have varying levels of hardness. Flux with a waxy hardness can reduce the deformation force from the bead, preventing proper contact with the test probe during the first pass contact.