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  2. Power electronic substrate - Wikipedia

    en.wikipedia.org/wiki/Power_electronic_substrate

    The substrate is attached to a heat spreader by soldering the bottom copper layer to it. A related technique uses a seed layer, photoimaging, and then additional copper plating to allow for fine lines (as small as 50 micrometres) and through-vias to connect front and back sides. This can be combined with polymer-based circuits to create high ...

  3. Rework (electronics) - Wikipedia

    en.wikipedia.org/wiki/Rework_(electronics)

    Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...

  4. Ball grid array - Wikipedia

    en.wikipedia.org/wiki/Ball_grid_array

    BGA ICs assembled on a Memory module. The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) on which it is placed.

  5. Solderability - Wikipedia

    en.wikipedia.org/wiki/Solderability

    Both quantitative and qualitative tests for solderability exist. [6] The two most common testing methods are the 'dip and look' method and wetting balance analysis.In both of these tests, the soldered pieces undergo an accelerated aging process before being tested for solderability, to take into consideration the time a component was in storage prior to mounting to final assembly.

  6. Power module - Wikipedia

    en.wikipedia.org/wiki/Power_module

    A power module or power electronic module provides the physical containment for several power components, usually power semiconductor devices. These power semiconductors (so-called dies ) are typically soldered or sintered on a power electronic substrate that carries the power semiconductors, provides electrical and thermal contact and ...

  7. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]

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  9. Mod Archive - Wikipedia

    en.wikipedia.org/wiki/Mod_Archive

    Since then, the site has emerged into being a community for artists and module enthusiasts. In an effort to make the website more dynamic, the community part of the site was added around 2000, in the form of message boards and an indexed search engine. Having lacked proper maintenance since around 2004, however, the site went through a complete ...