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Selective soldering machine. Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes.
X-ray picture of inadequate solder joints. Rework is practiced in many kinds of manufacturing when defective products are found. [2] For electronics, defects may include: Poor solder joints because of faulty assembly or thermal cycling. Solder bridges—unwanted drops of solder that connect points that should be isolated from each other.
Column grid array (CGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern. Ceramic column grid array (CCGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern. The body of the ...
The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components.. Compared to materials and techniques used in lower power microelectronics, these substrates must carry higher currents and provide a higher voltage isolation (up to several thousand vo
BGA ICs assembled on a Memory module. The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) on which it is placed.
Both quantitative and qualitative tests for solderability exist. [6] The two most common testing methods are the 'dip and look' method and wetting balance analysis.In both of these tests, the soldered pieces undergo an accelerated aging process before being tested for solderability, to take into consideration the time a component was in storage prior to mounting to final assembly.
These modules can be used with a variety of FPGA or microcontroller development boards from different vendors. The Pmod interface is designed so Pmods can be quickly connected to host boards for prototyping or evaluation purposes without soldering , but Pmods aren't quite plug and play since software and configuration is required.
Example Ramp to Spike thermal profile. Example of reflow soldering thermal profile.. Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat.
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