enow.com Web Search

Search results

1. Results from the WOW.Com Content Network

2. Scrub Daddy - Wikipedia

   en.wikipedia.org/wiki/Scrub_Daddy

   After damaging the exterior of a vehicle when cleaning the outside, detailer Aaron Krause invented a line of buffing and polishing pads. The company was acquired by 3M in August 2008. 3M did not purchase a line of sponges Krause had invented, leaving them to sit in his factory. Five years later, Krause used the remaining sponges to clean his ...

3. Polishing (metalworking) - Wikipedia

   en.wikipedia.org/wiki/Polishing_(metalworking)

   When buffing there are two types of buffing motions: the cut motion and the color motion. The cut motion is designed to give a uniform, smooth, semi-bright surface finish. This is achieved by moving the workpiece against the rotation of the buffing wheel, while using medium to hard pressure. The color motion gives a clean, bright, shiny surface ...

4. AOL

   search.aol.com

   The search engine that helps you find exactly what you're looking for. Find the most relevant information, video, images, and answers from all across the Web.

5. Floor scrubber - Wikipedia

   en.wikipedia.org/wiki/Floor_scrubber

   Floor buffers or rotary floor machines use rotary brushes of a soft material to clean, scrub, and polish linoleum surfaces. For marble and wood floors, floor polishers may be used to apply protective coating to the floor. [1] Floor burnisher is the term for a high speed floor buffer that rotates its pad at over 1000 RPM.

6. AOL Video - Serving the best video content from AOL and ...

   www.aol.com/video

   The AOL.com video experience serves up the best video content from AOL and around the web, curating informative and entertaining snackable videos.

7. Chemical-mechanical polishing - Wikipedia

   en.wikipedia.org/wiki/Chemical-mechanical_polishing

   The process uses an abrasive and corrosive chemical slurry (commonly a colloid) in conjunction with a polishing pad and retaining ring, typically of a greater diameter than the wafer. The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring.