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Liquid cooling is typically combined with air cooling, using liquid cooling for the hottest components, such as CPUs or GPUs, while retaining the simpler and cheaper air cooling for less demanding components. The IBM Aquasar system uses hot water cooling to achieve energy efficiency, the water being used to heat buildings as well. [40] [41]
In computing and electronics, liquid cooling involves the technology that uses a special water block to conduct heat away from the processor as well as the chipset. [1] This method can also be used in combination with other traditional cooling methods such as those that use air. The application to microelectronics is either indirect or direct.
Open-bath immersion cooling is a data center cooling technique that implies fully submerging IT equipment in dielectric liquid. The "open" aspect does not refer to an open or sealed system, but refers to the "open" liquid-air interface and thus surface tension between the liquid and the air is a distinctive element. [30]
In the case of the latter, it is done by using a fan blowing air into or onto the object one wants to cool. The addition of fins to a heat sink increases its total surface area, resulting in greater cooling effectiveness. There are two types of cooling pads that can be used for air cooling: one is the honeycomb design and another one is excelsior.
A water block is better at dissipating heat than an air-cooled heatsink due to water's higher specific heat capacity and thermal conductivity. The water is usually pumped through to a radiator which allows a fan pushing air through it to take the heat created from the device and expel it into the air. A radiator is more efficient than a ...
Air cooling uses either convective airflow (passive cooling), or a forced circulation using fans. Hydrogen is used as a high-performance gaseous coolant. Its thermal conductivity is higher than all other gases, it has high specific heat capacity , low density and therefore low viscosity , which is an advantage for rotary machines susceptible to ...
According to Telcordia GR-3028, Thermal Management in Telecommunications Central Offices, the most common way of cooling modern telecommunications equipment internally is by utilizing multiple high-speed fans to create forced convection cooling. Although direct and indirect liquid cooling may be introduced in the future, the current design of ...
A heat sink (also commonly spelled heatsink, [1]) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature.
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